The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2007
Filed:
Feb. 23, 2004
Junghyun Cho, Johnson City, NY (US);
Scott Oliver, Endwell, NY (US);
Wayne Jones, Vestal, NY (US);
Bahgat Sammakia, Binghamton, NY (US);
Junghyun Cho, Johnson City, NY (US);
Scott Oliver, Endwell, NY (US);
Wayne Jones, Vestal, NY (US);
Bahgat Sammakia, Binghamton, NY (US);
The Research Foundation of State University of New York, Binghamton, NY (US);
Abstract
A bi- or multi-layer coating is deposited upon a substrate using a low temperature process. The bi-layer is a lower layer of a SAM coating, which is overlaid with a hard coating. The hard coating can be made of materials such as: polymer, SiN, BN, TiN, SiO, AlO, ZrO, YSZ, and other ceramic materials, and the underlying, compliant, SAM coating can comprise substances containing long chain molecules that chemically bond to the substrate. This bi-layer provides both environmental and hermetical protection to electronic hardware and MEMS systems, without employing expensive packaging materials and processes. Multiple bi-layers may be combined to form multi-layer coatings. A protective polymer or other material may optionally be formed as an outside layer.