The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2007
Filed:
May. 05, 2005
Yuichi Takayoshi, Ibaraki, JP;
Mineyoshi Hasegawa, Ibaraki, JP;
Yasushi Tsuda, Ibaraki, JP;
Akinori Itokawa, Ibaraki, JP;
Yuichi Takayoshi, Ibaraki, JP;
Mineyoshi Hasegawa, Ibaraki, JP;
Yasushi Tsuda, Ibaraki, JP;
Akinori Itokawa, Ibaraki, JP;
Nitto Denko Corporation, Osaka, JP;
Abstract
An insulating substrate with metal foils on both sides thereof is prepared, and a through hole that passes through the metal foils and insulating substrate is formed. An electroless copper plating layer is formed on an inner surface of the through hole and a surface of each of the metal foils, followed by the formation of an electrolytic copper plating layer on the overall surface of the electroless copper plating layer. After removing the electrolytic copper plating layer except the portions on the inner surface and a peripheral region of the through hole, the metal foils are processed to form conductor patterns.