The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 09, 2007
Filed:
Nov. 20, 2003
Jee-soo Mok, Chungcheongbuk-do, KR;
Byung-kook Sun, Seoul, KR;
Chang-kyu Song, Daejeon, KR;
Geum-hee Yun, Kyunggi-Do, KR;
Tae-hoon Kim, Daejeon, KR;
Jee-Soo Mok, Chungcheongbuk-do, KR;
Byung-Kook Sun, Seoul, KR;
Chang-Kyu Song, Daejeon, KR;
Geum-Hee Yun, Kyunggi-Do, KR;
Tae-Hoon Kim, Daejeon, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon, Gyunggi-do, KR;
Abstract
Disclosed are a multi-layer printed circuit board and a method for manufacturing the multi-layer printed circuit board. Circuit layers and insulating layers are alternately stacked so that via holes of the circuit layers provided with plated inner walls without application of additional plating and conductive paste-filling steps are connected to via holes of the insulating layers filled with a conductive paste.