The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 09, 2007
Filed:
Jun. 27, 2003
Kong Weng Lee, Penang, MY;
Kee Yean NG, Penang, MY;
Yew Cheong Kuan, Penang, MY;
Gin Ghee Tan, Penang, MY;
Cheng Why Tan, Penang, MY;
Kong Weng Lee, Penang, MY;
Kee Yean Ng, Penang, MY;
Yew Cheong Kuan, Penang, MY;
Gin Ghee Tan, Penang, MY;
Cheng Why Tan, Penang, MY;
Avago Technologies ECBUIP (Singapore) Pte Ltd, Singapore, SG;
Abstract
A substantially planar substrate having opposed major surfaces is provided. The substrate includes a through hole that extends between the major surfaces. The through hole is filled with a conductive interconnecting element. A conductive mounting pad and a conductive connecting pad are formed on different ones of the major surfaces in electrical contact with the conductive interconnecting element. The packaging device formed by the method has a volume that is only a few times that of the semiconductor die and can be fabricated from materials that can withstand high-temperature die attach processes. The packaging device can be configured as the only packaging device used in the semiconductor device or as a submount for a semiconductor die that requires a high-temperature die attach process.