The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 09, 2007
Filed:
Sep. 10, 2004
Michael D. Camras, Sunnyvale, CA (US);
Michael R. Krames, Mountain View, CA (US);
Wayne L. Snyder, Palo Alto, CA (US);
Frank M. Steranka, San Jose, CA (US);
Robert C. Taber, Palo Alto, CA (US);
John J. Uebbing, Palo Alto, CA (US);
Douglas W. Pocius, Sunnyvale, CA (US);
Troy A. Trottier, San Jose, CA (US);
Christopher H. Lowery, Fremont, CA (US);
Gerd O. Mueller, San Jose, CA (US);
Regina B. Mueller-mach, San Jose, CA (US);
Gloria E. Hofler, Sunnyvale, CA (US);
Michael D. Camras, Sunnyvale, CA (US);
Michael R. Krames, Mountain View, CA (US);
Wayne L. Snyder, Palo Alto, CA (US);
Frank M. Steranka, San Jose, CA (US);
Robert C. Taber, Palo Alto, CA (US);
John J. Uebbing, Palo Alto, CA (US);
Douglas W. Pocius, Sunnyvale, CA (US);
Troy A. Trottier, San Jose, CA (US);
Christopher H. Lowery, Fremont, CA (US);
Gerd O. Mueller, San Jose, CA (US);
Regina B. Mueller-Mach, San Jose, CA (US);
Gloria E. Hofler, Sunnyvale, CA (US);
Philips Lumileds Lighting Company, LLC, San Jose, CA (US);
Abstract
A method of bonding a transparent optical element to a light emitting device having a stack of layers including semiconductor layers comprising an active region is provided. The method includes elevating a temperature of the optical element and the stack and applying a pressure to press the optical element and the stack together. In one embodiment, the method also includes disposing a layer of a transparent bonding material between the stack and the optical element. The bonding method can be applied to a premade optical element or to a block of optical element material which is later formed or shaped into an optical element such as a lens or an optical concentrator.