The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 02, 2007

Filed:

Sep. 07, 2004
Applicants:

Michael Bauer, Nittendorf, DE;

Wolfram Eurskens, Unterhaching, DE;

Gerold Gruendler, Regensburg, DE;

Rudolf Kerler, Lappersdorf, DE;

Heinz Pape, Aschheim, DE;

Peter Strobel, Regensburg, DE;

Inventors:

Michael Bauer, Nittendorf, DE;

Wolfram Eurskens, Unterhaching, DE;

Gerold Gruendler, Regensburg, DE;

Rudolf Kerler, Lappersdorf, DE;

Heinz Pape, Aschheim, DE;

Peter Strobel, Regensburg, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention relates to an electronic module having electronic components, which are arranged in vertically staggered component layers, which are electrically conductively connected to one another via regions, which are uncovered within the respective component layers, of contact bumps or of bonding connections and via interconnects, which are arranged between the component layers and are connected to the uncovered regions. Moreover, the invention relates to a process for producing the electronic module, either in a panel or as individual components.


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