The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7276784 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 02, 2007

Filed:

Oct. 11, 2005
Applicants:

Shoko Omizo, Kanagawa, JP;

Mikio Matsui, Fukuoka, JP;

Inventors:

Shoko Omizo, Kanagawa, JP;

Mikio Matsui, Fukuoka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device includes a base substrate; a first fixing layer provided on the base substrate; a first semiconductor chip fixed on the first fixing layer; a first substrate provided above the first semiconductor chip; a plurality of first connection members isolated from the first semiconductor chip, electrically connecting to the first substrate with the base substrate; and a first encapsulating layer provided around the first connection members.


Find Patent Forward Citations

Omizo, Shoko. (2007). Semiconductor device and a method of assembling a semiconductor device (U.S. Patent No. 7276784). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7276784

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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