The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 02, 2007
Filed:
Dec. 15, 2004
Billy Wang, Hsin Chu, TW;
Jonnie Chuang, Pan Chiao, TW;
Chi-wen Hung, Chung Li, TW;
Chuan-fa Lin, Shu Lin, TW;
Billy Wang, Hsin Chu, TW;
Jonnie Chuang, Pan Chiao, TW;
Chi-Wen Hung, Chung Li, TW;
Chuan-Fa Lin, Shu Lin, TW;
Harvatek Corporation, Hsin Chu, TW;
Abstract
A package structure for a semiconductor is described. The advantages thereof are that it has a great structural strength and when being penetrated by light, it will not be influenced by external light and can condense the light. Therefore, it is not easily be deformed so that the yield and quality of package can be increased, and when packaging an LED chip, it easily meets the package requirements of an electronic chip. In addition, the substrate structure is cheaper than the prior art, because a double-layered substrate is employed to improve the strength, and the package structure is also preferred because an external frame device is additionally used for preventing interference by external light. The package structure for the semiconductor has a substrate, an external frame device and a polymer filler.