The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 02, 2007
Filed:
Dec. 17, 2001
Applicants:
Klemens Ferstl, Regensburg, DE;
Andreas Woerz, Kelheim, DE;
Ulrich Vidal, Landshut, DE;
Inventors:
Assignee:
Infineon Technologies AG, Munich, DE;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract
A multichip module for leads-on-chip mounting is described. The multichip module has a lead-frame, a common, contiguous part of a wafer slice disposed in the lead-frame, and a number of semiconductor chips disposed next to one another in the lead-frame. At least some of the semiconductor chips disposed in the lead-frame are disposed on the common, contiguous part of the wafer slice.
Ferstl, Klemens. (2007). Multichip module for loc mounting and method for producing the multichip module (U.S. Patent No. 7276781). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7276781
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile