The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 02, 2007
Filed:
Jul. 11, 2005
Lianjun Liu, Gilbert, AZ (US);
Qiang LI, Gilbert, AZ (US);
Melvy F. Miller, Tempe, AZ (US);
Sergio P. Pacheco, Phoenix, AZ (US);
Lianjun Liu, Gilbert, AZ (US);
Qiang Li, Gilbert, AZ (US);
Melvy F. Miller, Tempe, AZ (US);
Sergio P. Pacheco, Phoenix, AZ (US);
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
An impedance matching network is integrated on a first die and coupled to a second die, with the first and second dies mounted on a conductive back plate. The impedance matching network comprises a first inductor bridging between the first and second dies, a second inductor coupled to the first inductor and disposed on the first die, and a metal-insulator-metal (MIM) capacitor disposed on the first die. The MIM capacitor has a first metal layer coupled to the second inductor, and a second metal layer grounded to the conductive back plate. A method for manufacturing the integrated impedance matching network comprises the steps of forming an inductor on a die, forming a capacitor on the die, coupling the capacitor to the inductor, coupling the die bottom surface and the capacitor to a conductive plate, and coupling the inductor to another inductor that bridges between the die and another die.