The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 02, 2007
Filed:
Jun. 13, 2002
Tomohiro Nakano, Fujisawa, JP;
Kiyoshi Adachi, Hiratsuka, JP;
Akira Kaneshige, Musashino, JP;
Molex Incorporated, Lisle, IL (US);
Abstract
A socket () for a semiconductor package having a plurality of solder balls () at its bottom surface. The socket () includes a socket body having a plurality of contacts () arranged in a shape to correspond in arrangement to the solder balls () of the semiconductor package. Each of the contacts () has a first and second contact piece contactable with the corresponding solder ball () while clamping the corresponding solder ball () from both side. The socket () includes a placing plate () capable of moving between a first position and a second position. The first, or semiconductor placing, position is where the semiconductor package is placed on the placing plate () without contact of the solder balls () of the semiconductor package with the first and second contact pieces, and the second, or contact, position is where the solder balls () of the placed semiconductor package are contactable with the corresponding first and second contact pieces.