The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 25, 2007
Filed:
Jul. 14, 2005
Applicants:
Megumi Yamamura, Hyogo-ken, JP;
Tetsuya Kaji, Hyogo-ken, JP;
Toshihide Shimmei, Hyogo-ken, JP;
Inventors:
Assignee:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01);
U.S. Cl.
CPC ...
Abstract
There is provided a semiconductor device including, a bed, a brazing filler metal formed on a first surface of the bed, a barrier metal film formed on a first surface of the brazing filler metal, a alloy film formed on a first surface of the barrier metal film, a semiconductor chip disposed on a first surface of the alloy film, a bonding wire electrically connecting between a terminal formed on a first surface of the semiconductor chip and a lead terminal, and a mold resin molding the bed, the brazing filler metal, the barrier metal film, the alloy film, the semiconductor chip and the bonding wire.