The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 25, 2007
Filed:
Nov. 04, 2003
Atsuhiro Sumiya, Hekinan, JP;
Eturo Yasuda, Okazaki, JP;
Hitoshi Shindo, Okazaki, JP;
Akira Fujii, Yokkaichi, JP;
Takashi Yamamoto, Chiryu, JP;
Toshiatsu Nagaya, Kuwana, JP;
Kumi Sawaguchi, Okazaki, JP;
Ryoji Kai, Okazaki, JP;
Atsuhiro Sumiya, Hekinan, JP;
Eturo Yasuda, Okazaki, JP;
Hitoshi Shindo, Okazaki, JP;
Akira Fujii, Yokkaichi, JP;
Takashi Yamamoto, Chiryu, JP;
Toshiatsu Nagaya, Kuwana, JP;
Kumi Sawaguchi, Okazaki, JP;
Ryoji Kai, Okazaki, JP;
Nippon Soken, Inc., , JP;
DENSO Corporation, , JP;
Abstract
A method of producing a laminated dielectric element of high quality, free of delamination. A method of producing a laminated dielectric elementby alternately laminating dielectric ceramic layersand base metal electrode layerscomprising the steps of printing electrodes by applying a paste material for the base metal electrodes onto the surfaces of at least one side of the ceramic green sheets, laminating and press-adhering the ceramic green sheets to fabricate a laminate thereof, dewaxing the laminate, reducing the electrodes to form base metal electrode layers by heating the laminate while flowing an atmospheric gas and by reducing the paste material for the base metal electrodes, and sintering the laminate. In the step of reducing the electrodes, the paste material for the base metal electrodes is so reduced that the amount of the base metal oxide remaining in the base metal electrode layers is not larger than 20% by weight and that the amount of lead liberated from the ceramic material is not larger than 30 atomic % within 5000 Å from the surfaces of the base metal electrode layers.