The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 18, 2007
Filed:
Dec. 01, 2004
Robert Downing Laclair, Richmond, VT (US);
Lawrence Carl Maier, New Haven, VT (US);
Anthony Dean Ringer, Vergennes, VT (US);
Robert Downing LaClair, Richmond, VT (US);
Lawrence Carl Maier, New Haven, VT (US);
Anthony Dean Ringer, Vergennes, VT (US);
Simmonds Precision Products, Inc., Vergennes, VT (US);
Abstract
A method of fabricating a multilayer wiring board proximity sensor includes forming a laminate, and fabricating a plurality of through-conductors through the layers of the laminate. The laminate has a plurality of layers including one or more core layers and a plurality of coil layers. Each core layer includes a core pattern formed of a permeable material, and each coil layer comprises at least one coil trace formed of a conducting material. Thus, the through-conductors may be fabricated through the layers of the laminate such that the coil traces are interconnected by the through-conductors to thereby form one or more coils disposed about at least a portion of the core patterns of the core layers.