The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 18, 2007
Filed:
Dec. 21, 2005
Tomofumi Arakawa, Tokyo, JP;
Mutsuhiro Ohmori, Kanagawa, JP;
Tomofumi Arakawa, Tokyo, JP;
Mutsuhiro Ohmori, Kanagawa, JP;
Sony Corporation, , JP;
Abstract
A semiconductor integrated circuit having a plurality of interconnect layers and at least one via connecting interconnects of two adjacent interconnect layers, wherein each interconnect layer has a plurality of first interconnect groups and second interconnect groups arranged respectively in a row and a column in a matrix. The first and the second interconnect groups are alternately arranged in each row and in each column of the matrix arranged facing each other between two adjacent interconnect layers. The first and second interconnect groups facing each other between the layers have crossing parts where they can be connected through vias.