The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 18, 2007

Filed:

Aug. 27, 2004
Applicants:

Hiroyuki Nishikawa, Shiga, JP;

Shigeo Tanahashi, Kyoto, JP;

Katsura Hayashi, Kagoshima, JP;

Inventors:

Hiroyuki Nishikawa, Shiga, JP;

Shigeo Tanahashi, Kyoto, JP;

Katsura Hayashi, Kagoshima, JP;

Assignee:

Kyocera Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/06 (2006.01); H01L 23/02 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

There is disclosed a wiring board comprising a core substratea build-up layerformed on at least one side of main surfaces the core substrate, wherein a cavityfor accommodating a chip-type decoupling capacitoris formed in the build-up layerThe capacitorincludes electrode terminals on an upper surface thereof that are directly connected to a semiconductor component, and electrode terminals on a back surface of the capacitoris connected to a wiring conductor layeron a bottom surface of the cavityThis structure enables decoupling capacitor and the semiconductor componentto be connected with low resistance and low inductance.


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