The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 18, 2007

Filed:

Jun. 14, 2005
Applicants:

Masayuki Ikeno, Gunma-ken, JP;

Shigeki Shudo, Gunma-ken, JP;

Naoki Yamakawa, Gunma-ken, JP;

Yujiro Taira, Gunma-ken, JP;

Inventors:

Masayuki Ikeno, Gunma-ken, JP;

Shigeki Shudo, Gunma-ken, JP;

Naoki Yamakawa, Gunma-ken, JP;

Yujiro Taira, Gunma-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 83/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

An addition reaction-curable liquid silicone rubber composition includes an organopolysiloxane containing at least one Si-bonded vinyl group only at each end of its backbone and having a viscosity of from 1 to 1,000 Pa·s at 25° C., an organopolysiloxane containing at least two Si-bonded vinyl groups only in side chains on its backbone and having a viscosity of from 0.1 to 100 Pa·s at 25° C., the amount of siloxane units bonded to the vinyl groups being from 2 to 20 mole % of its total siloxane units, finely divided silica having a specific surface area of at least 50 m/g, hexamethyldisilazane, water, an organohydrogenpolysiloxane containing at least two Si-bonded hydrogen atoms per molecule, and a hydrosilation catalyst. Another addition reaction-curable liquid silicone rubber composition additionally includes a specific non-functional dimethylpolysiloxane. The silicone rubber compositions are cured into products having a hardness of at least 75 as measured by a type-A durometer and an elongation at break of at least 200%.


Find Patent Forward Citations

Loading…