The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 18, 2007
Filed:
Feb. 02, 2005
Axel Brintzinger, Dresden, DE;
Octavio Trovarelli, Dresden, DE;
Axel Brintzinger, Dresden, DE;
Octavio Trovarelli, Dresden, DE;
Infineon Technologies AG, Munich, DE;
Abstract
A process produces metallic interconnects and contact surfaces on electronic components using a copper-nickel-gold layer structure. The copper core of the interconnects and contact surfaces is deposited by electroplating by means of a first resist mask made from positive resist. The copper core of the interconnects and contact surfaces is surrounded by a nickel-gold layer by means of a second resist mask. The interconnects and contact surfaces are produced by means of two resist masks arranged one on top of the other, in such a way that the copper which forms the core of the interconnect is completely surrounded by the nickel-gold layer, which extends above the copper core, and an adjoining layer that extends beneath the copper core and comprises a diffusion barrier and seed layer.