The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 18, 2007
Filed:
Jun. 09, 2005
Thomas J. Brunschwiler, Thalwil, CH;
Michel Despont, Au, CH;
Mark A. Lantz, Zürich, CH;
Bruno Michel, Adliswil, CH;
Peter Vettiger, Langnau am Albis, CH;
Thomas J. Brunschwiler, Thalwil, CH;
Michel Despont, Au, CH;
Mark A. Lantz, Zürich, CH;
Bruno Michel, Adliswil, CH;
Peter Vettiger, Langnau am Albis, CH;
International Business Machines Corporation, Armonk, NY (US);
Abstract
Provides semiconductor devices and method for fabricating devices having a high thermal dissipation efficiency. An example device comprises a thermally conducting structure attached to a surface of the semiconductor device via soldering. The thermally conducting structure is essentially formed of a thermally conducting material and comprises an array of freestanding fins, studs or frames, or a grid of connected fins. A process for fabricating such a semiconductor device includes forming a thermally conducting structure on a carrier and attaching the thermally conducting structure formed on the carrier to a surface of the semiconductor device via soldering.