The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 18, 2007
Filed:
Nov. 04, 2003
Stephen Michael Campbell, Winneconne, WI (US);
Daniel William Hesse, Neenah, WI (US);
Richard D. Schultz, Neenah, WI (US);
Mark J. Jung, Menasha, WI (US);
Richard M. Hansen, Oshkosh, WI (US);
Cristian M. Neculescu, Neenah, WI (US);
Sandra Marie Rogers, Appleton, WI (US);
Violet May Grube, Greenville, WI (US);
Rhiannon L. Thoresen, Appleton, WI (US);
Thomas Michael Killian, Sobieski, WI (US);
Jonathan K. Rice, Appleton, WI (US);
Palani Raj Ramaswami Wallajapet, Neenah, WI (US);
Courtney Eileen Shea, Atlanta, GA (US);
Jason Sybren Fairbanks, Gainesville, GA (US);
Prasad Shrikrishna Potnis, Duluth, GA (US);
Randall J. Palmer, Canton, GA (US);
Stephen Michael Campbell, Winneconne, WI (US);
Daniel William Hesse, Neenah, WI (US);
Richard D. Schultz, Neenah, WI (US);
Mark J. Jung, Menasha, WI (US);
Richard M. Hansen, Oshkosh, WI (US);
Cristian M. Neculescu, Neenah, WI (US);
Sandra Marie Rogers, Appleton, WI (US);
Violet May Grube, Greenville, WI (US);
Rhiannon L. Thoresen, Appleton, WI (US);
Thomas Michael Killian, Sobieski, WI (US);
Jonathan K. Rice, Appleton, WI (US);
Palani Raj Ramaswami Wallajapet, Neenah, WI (US);
Courtney Eileen Shea, Atlanta, GA (US);
Jason Sybren Fairbanks, Gainesville, GA (US);
Prasad Shrikrishna Potnis, Duluth, GA (US);
Randall J. Palmer, Canton, GA (US);
Kimberly-Clark Worldwide, Inc., Neenah, WI (US);
Abstract
A bonded structure including one or more substrates bonded together with a tackified amorphous poly-alpha-olefin adhesive composition. One method of making such a bonded structure is carried out by applying a tackified amorphous poly-alpha-olefin adhesive composition to one or more substrates at a temperature of about 170 degrees Celsius or lower, and joining the substrates to themselves or to one another. The bonded structure has a dynamic peel strength between about 400 and about 1000 grams per 25 millimeters. The bonding efficiency of the bonded structure renders the bonded structure suitable for incorporation into a variety of articles, including personal care products, health/medical products, and household/industrial product, for example.