The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 18, 2007

Filed:

Mar. 16, 2005
Applicants:

Jainamma Krotz, San Diego, CA (US);

Daniel J. Smolko, Jamul, CA (US);

Howard R. Reese, Poway, CA (US);

Thomas J. Onofrey, San Marcos, CA (US);

Daguang Wang, San Diego, CA (US);

Theodore M. Winger, San Diego, CA (US);

John R. Havens, San Diego, CA (US);

Inventors:

Jainamma Krotz, San Diego, CA (US);

Daniel J. Smolko, Jamul, CA (US);

Howard R. Reese, Poway, CA (US);

Thomas J. Onofrey, San Marcos, CA (US);

Daguang Wang, San Diego, CA (US);

Theodore M. Winger, San Diego, CA (US);

John R. Havens, San Diego, CA (US);

Assignee:

Nanogen, Inc., San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/00 (2006.01); B01D 29/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides improved synthetic polymer hydrogel permeation layers for use on active electronic matrix devices for biological assays. The present invention includes methods for forming a permeation layer on an array of microelectrodes including the steps of attaching a linker to the surface of the array by treating the surface with a linker by vapor deposition and providing a polymerization solution that includes at least one monomer having a polymerizable moiety, a modified streptavidin, a surfactant or porogen, and a cross-linking agent. The surface of the array is then contacted with the polymerization solution and the polymerization solution is then polymerized on the surface of the array to form a permeation layer that is attached o the surface of the array through the linker.


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