The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 18, 2007
Filed:
Jul. 09, 2003
Takeshi Nishiuchi, Osaka, JP;
Yoshimi Tochishita, Hyogo, JP;
Fumiaki Kikui, Osaka, JP;
Mitsuo Kizawa, Hyogo, JP;
Takeshi Nishiuchi, Osaka, JP;
Yoshimi Tochishita, Hyogo, JP;
Fumiaki Kikui, Osaka, JP;
Mitsuo Kizawa, Hyogo, JP;
Sumitomo Special Metals Co., Ltd., Osaka-shi, JP;
Abstract
A surface treating process according to the present invention, a vapor deposited film is formed from an easily oxidizable vapor-depositing material on the surface of a work by evaporating the vapor-depositing material in a state in which the vapor deposition controlling gas has been supplied to at least zones near a melting/evaporating source and the work within a treating chamber. Thus, the vapor deposited film can be formed stably on the surface of a desired work without requirement of a long time for providing a high degree of vacuum and without use of a special apparatus. In addition, the use of the surface treating process ensures that a corrosion resistance can be provided to a rare earth metal-based permanent magnet extremely liable to be oxidized, without degradation of a high magnetic characteristic of the magnet. A surface treating apparatus according to the present invention includes a melting/evaporating source for melting and evaporating a wire-shaped vapor-depositing material containing a vapor deposition controlling gas, and a member for retaining a work on which the vapor-depositing material is deposited. The melting/evaporating source and the work retaining member are disposed in a treating chamber of the surface treating chamber. The apparatus further includes a vapor-depositing material supply means for supplying the wire-shaped vapor-depositing material containing the vapor deposition controlling gas to the melting-evaporating source.