The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 2007
Filed:
Mar. 17, 2005
Yoshiyuki Komura, Kyotanabe, JP;
Kazuyuki Hayamizu, Kyotanabe, JP;
Masayoshi Higuchi, Soraku-gun, JP;
Hisashi Taniguchi, Kyotanabe, JP;
Yukari Terakawa, Kyoto, JP;
Hayami Hosokawa, Tsuzuki-gun, JP;
Yoshiyuki Komura, Kyotanabe, JP;
Kazuyuki Hayamizu, Kyotanabe, JP;
Masayoshi Higuchi, Soraku-gun, JP;
Hisashi Taniguchi, Kyotanabe, JP;
Yukari Terakawa, Kyoto, JP;
Hayami Hosokawa, Tsuzuki-gun, JP;
Omron Corporation, Kyoto, JP;
Abstract
The spacersandand the recess is formed on the supporting substrateto support the upper cladding layer. The intermediate surfaceandlower than the top surface of the spacersandand higher than the inner bottom surface of the recess is formed on the supporting substrate. Each of the height between the top surface of the spacersandand the intermediate surfacesand, and the height between the intermediate surfacesandand the inner bottom surface of the recess of the second substratebecomes thin compared with the total thickness of the lower cladding layer. Thus, when the resin for the lower cladding layeris cured to shrinkage, the inner stress in the resin is dispersed and the occurrence of the wrinkleand the void decreases.