The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 2007
Filed:
Feb. 01, 2005
Craig Warren Hornung, Harrisburg, PA (US);
John Thomas Larkin, Jr., Camp Hill, PA (US);
Ralph Edward Spayd, Jr., Elizabethtown, PA (US);
Craig Warren Hornung, Harrisburg, PA (US);
John Thomas Larkin, Jr., Camp Hill, PA (US);
Ralph Edward Spayd, Jr., Elizabethtown, PA (US);
Tyco Electronics Corporation, Middletown, PA (US);
Abstract
A heat sink assembly for cooling a heat generating integrated circuit (IC) component is provided. The assembly includes a heat sink base positioned adjacent the IC component and a thermal interface member positioned between the heat sink base and the IC component. The interface member has a first surface in abutting engagement with the heat sink base and an opposite second surface in abutting engagement with an outer surface of a lid on the IC component. The first and second surfaces each include a plurality of protrusions to increase a number of contact points between the interface member and the heat sink base and between the interface member and the outer surface of the lid to facilitate a transfer of heat from the IC component to the heat sink base.