The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 2007
Filed:
Nov. 10, 2004
Deepak A. Ramappa, Dallas, TX (US);
Mona Eissa, Allen, TX (US);
Christopher Lyle Borst, Plano, TX (US);
Ting Y. Tsui, Garland, TX (US);
Deepak A. Ramappa, Dallas, TX (US);
Mona Eissa, Allen, TX (US);
Christopher Lyle Borst, Plano, TX (US);
Ting Y. Tsui, Garland, TX (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
Methods () are presented for protecting copper structures () from corrosion in the fabrication of semiconductor devices (), wherein a thin semiconductor or copper-semiconductor alloy corrosion protection layer () is formed on an exposed surface () of a copper structure () prior to performance of metrology operations (), so as to inhibit corrosion of the copper structure (). All or a portion of the corrosion protection layer () is then removed () in forming an opening in an overlying dielectric () in a subsequent interconnect layer.