The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 2007
Filed:
Sep. 26, 2003
Applicants:
Jao-ching Lin, Hsin-Chuang, TW;
Pei-pei Ding, Hsin-Chuang, TW;
Inventors:
Jao-Ching Lin, Hsin-Chuang, TW;
Pei-Pei Ding, Hsin-Chuang, TW;
Assignee:
Sentelic Corporation, Taipei, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C25D 1/00 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of making a microstructure includes the steps of providing a circuit board that includes a dielectric layer and a conductor layer formed on the dielectric layer, forming a metal structure on the circuit board such that the metal structure extends through the dielectric layer, and removing at least a portion of the dielectric layer adjacent to the conductor layer and the metal structure to result in the microstructure.
Lin, Jao-Ching. (2007). Method of making a microstructure using a circuit board (U.S. Patent No. 7267755). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7267755
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile