The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 2007
Filed:
Jan. 31, 2003
Janice Danvir, Arlington Heights, IL (US);
Katherine Devanie, Arlington Heights, IL (US);
Nadia Yala, Schaumburg, IL (US);
Janice Danvir, Arlington Heights, IL (US);
Katherine Devanie, Arlington Heights, IL (US);
Nadia Yala, Schaumburg, IL (US);
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
A self supported underfill film () adhesively bonds surface mount integrated circuit packages () to a printed circuit board (). The printed circuit board has conductive traces () and exposed conductive pads () on the surface. A film adhesive is strategically positioned on the printed circuit board near the conductive pads, and the surface mount integrated circuit package is then placed on the board so that the conductive pads () on the package align with the conductive pads on the board. The film adhesive softens when the package is soldered to the board, and the film ultimately serves as an underfill to increase the mechanical integrity of the solder joints.