The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 2007
Filed:
Jul. 15, 2005
Naoyuki Inoue, Ibo-Gun, JP;
Naoyuki Inoue, Ibo-Gun, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
A semiconductor device according to an embodiment of the present invention comprises a packaging substrate mounted with semiconductor chips; a heat dissipation metal plate having three or more sides and mounted with the packaging substrates; a frame provided along an external periphery of the heat dissipation metal plate and encircling the packaging substrates; an adhesive provided to between the heat dissipation metal plate and the frame to bond the heat dissipation metal plate and the frame together; and a sealing resin sealing the semiconductor chips and the packaging substrates within a box formed by the heat dissipation metal plate and the frame, wherein the volume of the adhesive at corners of the heat dissipation metal plate is smaller than that on the sides thereof.