The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 04, 2007

Filed:

Apr. 29, 2005
Applicants:

Howard R. Test, Plano, TX (US);

Michael A. Lamson, Anna, TX (US);

Inventors:

Howard R. Test, Plano, TX (US);

Michael A. Lamson, Anna, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device has a semiconductor chip with a periphery and an IC organized in a core portion and a peripheral portion. The IC has a top level of interconnecting metal traces () from the peripheral portion to the core portion; the traces are covered by an insulating overcoat () which has peripheral windows to expose bond pads. The circuit further has at least one level of metal lines () on top of the insulating overcoat; the lines lead from the chip periphery towards the chip core, wherein each line () is substantially parallel to one of the traces () underneath the insulating overcoat and vertically aligned therewith. After assembling the chip onto a leadframe with segments (), bonding wires () connect the bond pads () and the metal lines () with the segments.


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