The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 2007
Filed:
Aug. 25, 2006
John F. Casey, Colorado Springs, CO (US);
Lewis R. Dove, Monument, CO (US);
Ling Liu, Colorado Springs, CO (US);
James R. Drehle, Colorado Springs, CO (US);
R. Frederick Rau, Jr., Colorado Springs, CO (US);
Rosemary O. Johnson, Colorado Springs, CO (US);
Julius Botka, Santa Rosa, CA (US);
John F. Casey, Colorado Springs, CO (US);
Lewis R. Dove, Monument, CO (US);
Ling Liu, Colorado Springs, CO (US);
James R. Drehle, Colorado Springs, CO (US);
R. Frederick Rau, Jr., Colorado Springs, CO (US);
Rosemary O. Johnson, Colorado Springs, CO (US);
Julius Botka, Santa Rosa, CA (US);
Agilent Technologies, Inc., Santa Clara, CA (US);
Abstract
Disclosed are methods for making microwave circuits using thickfilm components. In an embodiment, the method includes depositing a dielectric over a ground plane, and then forming a conductor on the dielectric. The conductor is formed by depositing a conductive thickfilm on the dielectric and then 'subsintering' the conductive thickfilm. In one embodiment, before the subsintering, the conductive thickfilm is patterned to define at least one conductor. In another embodiment, after the subsintering, the conductive thickfilm is patterned to define at least one conductor. After subsintering, the conductive thickfilm is etched to expose the conductor(s), and the conductor(s) are then fired at a full sintering temperature.