The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 2007
Filed:
Oct. 07, 2005
Jae-june Kim, Kyoungki-do, KR;
Jae-June Kim, Kyoungki-do, KR;
Epworks Co., Ltd., Seoul, KR;
Abstract
The present invention provides a method for manufacturing a wafer level chip scale package using a redistribution substrate, which has patterned bump pairs connected by redistribution lines and formed on a transparent insulating substrate. The redistribution substrate is produced separately from a wafer and then bonded to the wafer. One part of each bump pair is in contact with a chip pad on the active surface of the wafer, and the other part coincides with one of holes formed in the wafer. Conductive lines are formed in the holes and on the non-active surface of the wafer. External connection terminals are formed on the conductive lines at the non-active surface.