The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7263759 B1

PDF
Full Text
Expired
Date of Patent:
Sep. 04, 2007

Filed:

Jan. 02, 2003
Applicants:

Filippo Marino, Tremestieri Etneo, IT;

Salvatore Capici, Barrafranca, IT;

Inventors:

Filippo Marino, Tremestieri Etneo, IT;

Salvatore Capici, Barrafranca, IT;

Assignee:

STMicroelectronics S.r.l., Agrate Brianza, IT;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/28 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of making and testing an electronic device that includes providing first and second external pins, first and second pads on the substrate connected to the first external pin by respective bonding wires, and third and fourth pads on the substrate connected to the second external pin respective bonding wires, and to a first common line by respective resistors. With a circuit configuration of this type, the intactness of the bonding wires can easily be checked by carrying out a simple resistance measurement between the first and the second external pin.


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Marino, Filippo. (2007). Methods of manufacturing and testing bonding wires (U.S. Patent No. 7263759). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7263759

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