The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2007
Filed:
Dec. 17, 2003
Yoshihiro Ohkura, Iwata-gun, JP;
Yoshihiro Ohkura, Iwata-gun, JP;
Yamaha Corporation, , JP;
Abstract
A surface mount chip package comprises a package housing made of a prescribed resin, which is formed to cover a semiconductor chip while avoiding a plurality of conductors extending from the semiconductor chip. A plurality of solder balls are arranged in the package housing in correspondence with a main surface of the semiconductor chip having an integrated circuit and are interconnected with the conductors respectively. An index serving as a marking member is arranged together with the solder balls so as to bring a directivity realized by the shape thereof when viewed in the thickness direction of the semiconductor chip. This allows a user to easily recognize the inclination and position of the package housing without using the solder balls in view of the index, thus establishing a prescribed positioning for an electrical test such as a probing test.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile