The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2007
Filed:
Jan. 18, 2005
Applicants:
David M. Craig, Albany, OR (US);
Chien-hua Chen, Corvallis, OR (US);
Charles C. Haluzak, Corvallis, OR (US);
Ronnie J. Yenchik, Blodgett, OR (US);
Inventors:
David M. Craig, Albany, OR (US);
Chien-Hua Chen, Corvallis, OR (US);
Charles C. Haluzak, Corvallis, OR (US);
Ronnie J. Yenchik, Blodgett, OR (US);
Assignee:
Hewlett-Packard Development Company, L.P., Houston, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
An assembly includes a substrate, a device coupled to the substrate; a ring formed on the substrate; and one or more bonding pads formed on the substrate, wherein the ring and bonding pads are formed of a same material.
Quick Actions:
Craig, David. (2007). Assembly with a ring and bonding pads formed of a same material on a substrate (U.S. Patent No. 7262498). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7262498
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile