The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2007
Filed:
Jan. 31, 2005
Ki-kwon Jeong, Cheonan-si, KR;
Hyeon Hwang, Cheonan-si, KR;
Ki-kwon Jeong, Cheonan-si, KR;
Hyeon Hwang, Cheonan-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Abstract
A die attaching method of a semiconductor chip simplifies the process of fabricating a package from the chip while preventing the chip form being damaged even when the chip is very thin. Warpage prevention material is adhered to a top surface of a wafer having a plurality of chips formed thereon, and then the wafer is cut to separate the chips from one another. Each semiconductor chip is then placed on and attached to a die pad of a base frame, while the warpage prevention material is detached from the semiconductor chip. Thus, the warpage prevention material is removed without requiring a process that is extraneous to the die attaching process.