The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2007
Filed:
Feb. 07, 2005
Seigo Hishiki, Nagoya, JP;
Seigo Hishiki, Nagoya, JP;
Inoac Corporation, Aichi, JP;
Rogers Inoac Corporation, Tokyo, JP;
Abstract
A single-layered polishing pad suitable for chemical mechanical polishing (CMP) of semiconductor wafers, etc., which attains excellent step height reduction and in-plane uniformity and is integrally molded by reaction injection molding, is provided. The polishing pad is a polyurethane-based foamhaving a desired shape, as obtained by molding a gas-dissolved raw material having an inert gas dissolved under pressure in a polyurethane-base resin raw material by a reaction injection molding method, and includes a polishing regionhaving a polishing surfacesuitable for polishing semi-conductor materials, etc. and having a Shore D hardness in the range of from 40 to 80 and a stress reduction regionwhich is present in the side opposing to the polishing surfaceand which, when provided with a stress adjusting portionof a desired pattern, is set up so as to have an amount of deflection, as applied with a load of 0.05 MPa, of 10 μm or more.