The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 21, 2007
Filed:
Nov. 25, 2003
Hoi-jin Lee, Seongnam, KR;
Hoi-Jin Lee, Seongnam, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
A speed binning test circuit for a semiconductor device may include a plurality of circuit groups arranged along a boundary of a chip circuit. Each circuit group may include a different number of unit delay circuits that may form a chain structure. The speed binning test circuit may also include a plurality of pads. Each pad may be arranged between a pair of circuit groups so that at least one output terminal of a unit delay circuit of one of the plurality of circuit groups is connected to one of the pads. The speed binning test device performs a speed binning test method in which a signal through the circuit groups is delayed, and on-chip-variations are monitored to determine a total signal delay time through the chain structure.