The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 21, 2007
Filed:
Dec. 17, 2003
William Freeman, Castro Valley, CA (US);
Hong Jin Jiang, Singapore, SG;
William Freeman, Castro Valley, CA (US);
Hong Jin Jiang, Singapore, SG;
Finisar Corporation, Sunnyvale, CA (US);
Abstract
Exemplary embodiments of the present invention are drawn to improved systems and process for anodically bonding multiple substrate wafers to each other at low temperatures. At least one circuit wafer having printed circuits thereon is bonded to an interposer wafer by applying an amorphous thin film between the wafers. A low voltage is applied across the wafers to heat the wafers and to cause bonding of the wafers. Multiple circuit and interposer wafers can be used. The bonding temperature is low enough that soldered connections on the circuit wafers will not flow or otherwise distort, thus maintaining electrical integrity.