The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 21, 2007
Filed:
Sep. 23, 2003
Daniel K. Lau, San Francisco, CA (US);
Edward L. T. Law, Chandler, AZ (US);
Daniel K. Lau, San Francisco, CA (US);
Edward L. T. Law, Chandler, AZ (US);
Advanced Interconnect Technologies Limited, Port Louis, MU;
Abstract
A heat spreader () is added to a package to enhance thermal and advantageously electrical performance. In manufacture, a heat spreader precursor () is advantageously placed over a group of dies and secured after bonding (e.g., wire or tape bonding or flip-chip bonding) and before matrix/block mold. For example, a package strip () may consist of a row (linear array) of groups of die attach areas (e.g. in a rectangular array of four). The heat spreader precursor () may accommodate one such group or multiple groups along the package strip (). The package strip () may then be singulated to form the individual packages. Each singulated package includes a die (), its associated substrate(e.g., either a lead frame or interposer type substrate) and a portion of the heat spreader precursor () as a heat spreader ().