The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 21, 2007
Filed:
Nov. 04, 2004
Joseph Cachina, Warwick, RI (US);
James Zanolli, North Smithfield, RI (US);
Joseph Cachina, Warwick, RI (US);
James Zanolli, North Smithfield, RI (US);
Teka Interconnections Systems, Inc., Warwick, RI (US);
Abstract
A solder-bearing wafer is provided for use in a soldering operation. The solder-bearing wafer is designed to provide a solder material which is used in a soldering operation for electrically connecting a first electronic device to a second electronic device. According to a first embodiment, the wafer comprises a substrate body having a first surface and an opposing second surface. The first surface has at least one groove formed therein and the wafer also includes at least one length of solder material securely disposed within the at least one groove. Upon heating of the at least length of solder material and placement of the substrate body between the first and second electronic devices, at least one first contact of the first electronic device is securely and electrically connected to at least one second contact of the second electronic device. The first and second electronic devices may be of a through hole type, surface mount type, or ball grid array type.