The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 21, 2007
Filed:
Oct. 07, 2005
Applicant:
Rudolf Lehner, Laaber, DE;
Inventor:
Rudolf Lehner, Laaber, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/4763 (2006.01); B23K 31/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
An apparatus for singulating and bonding semiconductor chips includes a singulating station and a mounting station. In the singulating station, a semiconductor chip is provided with a bonding wire by a bonding tool and lifted off a carrier film. Then, in the mounting station, the semiconductor chip is placed on a chip mounting surface and fixed in place. The bonding wire is guided to a contact-connection surface of the circuit carrier and bonded to this surface.