The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 21, 2007
Filed:
Oct. 18, 2002
Luisa M. Deckard, College Station, TX (US);
Jennifer J. Zinck, Calabasas, CA (US);
Luisa M. Deckard, College Station, TX (US);
Jennifer J. Zinck, Calabasas, CA (US);
HRL Laboratories, LLC, Malibu, CA (US);
Abstract
A method for making a part, the method comprising: (a) providing an uncured upper layer on a part, a substrate, a workpiece, a support platform, or a base layer, wherein the uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices; (b) optionally providing a new uncured upper layer on the uncured upper layer provided in step (a), whereby the uncured upper layer provided in step (a) becomes an uncured lower layer, and wherein the new uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices; (c) curing the uncured upper layer and/or the uncured lower layer after step (b) using an electron beam; (d) after step (c), providing a new uncured upper layer on the cured or uncured upper layer, whereby the cured or uncured upper layer becomes a cured or uncured lower layer, and wherein the new uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices; (e) optionally curing the lower layer resulting from step (d) if the lower layer is uncured to yield a cured lower layer; (f) after step (e), optionally providing a new uncured upper layer on the uncured upper layer provided in step (d), whereby the uncured upper layer provided in step (d) becomes an uncured lower layer, and wherein the new uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices; (g) after step (f) curing the uncured upper layer and/or the uncured lower layer(s) after step (f) using an electron beam; and (h) optionally repeating steps (d) through (g) a number of times to form a desired number of cured layers.