The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 21, 2007

Filed:

Oct. 28, 2002
Applicants:

Yoshiyuki Shimada, Itami-shi, JP;

Hitoshi Oyama, Itami-shi, JP;

Takao Nishioka, Itami-shi, JP;

Inventors:

Yoshiyuki Shimada, Itami-shi, JP;

Hitoshi Oyama, Itami-shi, JP;

Takao Nishioka, Itami-shi, JP;

Assignees:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01F 1/26 (2006.01); H01F 1/33 (2006.01);
U.S. Cl.
CPC ...
Abstract

A compound magnetic material having high heat resistance is provided. A fabrication method of a compound magnetic material includes the step of preparing mixed powder including an organic resin and compound magnetic particles. The long-period heat resistance temperature of the organic resin is at least 200° C. The containing ratio of the organic resin to the compound magnetic particles exceeds 0 mass % and not more than 0.2 mass %. The compound magnetic particle includes a metal magnetic particles, and a coat layer containing metal oxide, directly bound to the surface of the metal magnetic particle. The fabrication method of a compound magnetic material includes the steps of forming a compact by introducing mixed powder into a die having a lubricant applied to its surface and conducting warm-compacting, and applying heat treatment to the compact.


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