The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 21, 2007
Filed:
Jun. 10, 2004
Chang-woong Chu, Suwon, KR;
Kyeong-koo Chi, Seoul, KR;
Ji-soo Kim, Sungnam, KR;
Seung-pil Chung, Seoul, KR;
Sang-hun Seo, Daejeon, KR;
Chang-woong Chu, Suwon, KR;
Kyeong-koo Chi, Seoul, KR;
Ji-soo Kim, Sungnam, KR;
Seung-pil Chung, Seoul, KR;
Sang-hun Seo, Daejeon, KR;
Samsung Electronics Co., Ltd., Suwon, Kyungki-do, KR;
Abstract
A wafer stage including an electrostatic chuck and a method for dechucking a wafer using the wafer stage are provided, wherein, the wafer stage includes an electrostatic chuck support, an electrostatic chuck, a lifting means, and a grounding means including a device for connecting the interconnections for grounding the lifting means. According to the method for dechucking a wafer, when a lifting means is in contact with a rear side of the wafer, the lifting means is grounded. Then, an electrostatic chuck is neutralized by supplying power to electrostatic electrodes, and the wafer is neutralized by supplying plasma to the wafer.