The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 21, 2007
Filed:
Sep. 30, 2004
Dennis R. Barringer, Wallkill, NY (US);
Shawn Canfield, Poughkeepsie, NY (US);
David C. Linnell, Poughkeepsie, NY (US);
Robert L. Nicoletti, Milton, NY (US);
Harold M. Toffler, Newburgh, NY (US);
Dennis R. Barringer, Wallkill, NY (US);
Shawn Canfield, Poughkeepsie, NY (US);
David C. Linnell, Poughkeepsie, NY (US);
Robert L. Nicoletti, Milton, NY (US);
Harold M. Toffler, Newburgh, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A snap-fit shield is provided which fits securely within a frame opening, and which shields and grounds the opening while eliminating a need for a complementary connector portion. The shield has an insulative inner housing having a first base wall and a first pair of side walls and end walls extending therefrom defining a first cavity. The shield includes a conductive shell having a second base wall and a second pair of side walls and end walls extending therefrom defining a second cavity. The second pair of side walls and end walls have at least one outward bias positioned thereon. The shield also has an insulative outer housing having a third base wall and a third pair of side walls and end walls extending therefrom defining a third cavity. The outer housing is configured to snap-fit within an opening in a frame so as to shield circuitry internal thereto. The third cavity of the outer housing is configured to receive at least a portion of the conductive shield therein, while the second cavity of the conductive shield is configured to receive the inner housing therein.