The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2007
Filed:
Nov. 02, 2004
Jun Ishikawa, Aichi-ken, JP;
Toshiaki Nagase, Aichi-ken, JP;
Hiroyuki Onishi, Aichi-ken, JP;
Koichi Akagawa, Aichi-ken, JP;
Jun Ishikawa, Aichi-ken, JP;
Toshiaki Nagase, Aichi-ken, JP;
Hiroyuki Onishi, Aichi-ken, JP;
Koichi Akagawa, Aichi-ken, JP;
Kabushiki Kaisha Toyota Jidoshokki, Kariya-shi, JP;
Abstract
In a semiconductor apparatus in which a main current of a semiconductor device flows through a wiring pattern formed on an insulation circuit board, the rise in temperature of the wiring pattern is suppressed and the increase in cost of parts can be minimized. On the insulation circuit board, a copper pattern is formed. A heat spreader is soldered to the copper pattern, and the heat spreader is loaded with a semiconductor chip. An external electrode and the heat spreader are arranged to shorten the distance between the side of the external electrode and the side of the heat spreader.