The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2007
Filed:
Jun. 27, 2003
Kong Weng Lee, Penang, MY;
Kee Yean NG, Penang, MY;
Yew Cheong Kuan, Penang, MY;
Gin Ghee Tan, Penang, MY;
Cheng Why Tan, Penang, MY;
Kong Weng Lee, Penang, MY;
Kee Yean Ng, Penang, MY;
Yew Cheong Kuan, Penang, MY;
Gin Ghee Tan, Penang, MY;
Cheng Why Tan, Penang, MY;
Avago Technologies ECBU IP (Singapore) Pte. Ltd., Singapore, SG;
Abstract
The packaging device includes a substrate, a mounting pad, a connecting pad and an interconnecting element. The substrate is substantially planar and has opposed major surfaces. The mounting pad is conductive and is located on one of the major surfaces. The connecting pad is conductive and is located on the other of the major surfaces. The conductive interconnecting element extends through the substrate and electrically interconnects the mounting pad and the connecting pad. The packaging device has a volume that is only a few times that of the semiconductor die and can be fabricated from materials that can withstand high-temperature die attach processes. The packaging device can be configured as the only packaging device used in the semiconductor device or as a submount for a semiconductor die that requires a high-temperature die attach process.