The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2007
Filed:
Dec. 29, 2004
Jung Joo Kim, Bucheon, KR;
Jung Joo Kim, Bucheon, KR;
Dongbu Electronics Co., Ltd., Seoul, KR;
Abstract
The present invention provides a Cu line and method of forming the same, by which reliability (e.g., EM, BTS and the like) can be enhanced by replacing SiN by HfO, which plays a role as a protective layer and/or an etch stop layer on a Cu line, prevents or inhibits galvanic corrosion due to Cu oxide, and inhibits or reduces additional formation of Cu oxide by gathering or scavenging oxygen atoms from —OH, O, and HO. The present method includes the steps of forming a trench in an insulating layer on a substrate, forming a planarized Cu layer in the trench, forming a HfOlayer on the planarized Cu layer, and thermally treating the substrate.