The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2007
Filed:
Mar. 11, 2003
Ken Sakata, Shimonoseki, JP;
Katsuhiko Hayashi, Ageo, JP;
Ken Sakata, Shimonoseki, JP;
Katsuhiko Hayashi, Ageo, JP;
Mitsui Mining & Smelting Co., Ltd., Tokyo, JP;
Abstract
Provision of a releasing layer transfer film which can form, in a simple manner, a releasing layer on a COF flexible printed wiring board, the releasing layer preventing melt adhesion of an insulating layer to a heating tool, thereby enhancing productivity and reliability of semiconductor devices produced by use of a semiconductor chip mounting line. The releasing layer transfer filmfor forming a releasing layer onto an insulating layer serving as a component layer of a COF flexible printed wiring board, the releasing layer transfer film includes a transfer film substrateand a transferable releasing layerprovided on a surface of the transfer film substrate, wherein the transferable releasing layeris formed from a releasing agent and can be transferred onto the insulating layer.