The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2007
Filed:
Dec. 28, 2004
Soon Bog Kwon, Kyungki-do, KR;
Sang Hun Lee, Kyungki-do, KR;
Yang Sik Moon, Seoul, KR;
Ki Pyo Hong, Pusan, KR;
Yoon Kuen Cho, Kyungsangbuk-do, KR;
Soon Bog Kwon, Kyungki-do, KR;
Sang Hun Lee, Kyungki-do, KR;
Yang Sik Moon, Seoul, KR;
Ki Pyo Hong, Pusan, KR;
Yoon Kuen Cho, Kyungsangbuk-do, KR;
LG Electronics Inc., Seoul, KR;
LG Micron Co., Ltd., Kumi-si, KR;
Abstract
A method for fabricating a tape substrate includes forming, on an insulating film, a copper foil pattern having a connecting area; coating a solder resist on the formed copper foil pattern, at a region other than the connecting area; plating a barrier layer on the copper foil pattern at the connecting area after the coating of the solder resist; and plating tin on the plated barrier layer plated, thereby forming a tin layer on the barrier layer. Another method for fabricating a tape substrate includes forming, on an insulating film, a copper foil pattern having a connecting area; plating a barrier layer over the formed copper foil pattern; plating tin over the barrier layer after the plating of the barrier layer, thereby forming a tin layer over the barrier layer; and coating a solder resist on the tin layer at a region other than the connecting area, after the formation of the tin layer.